Successful completion of the industry’s first HSUPA test calls delivering 2.0 Mbps on the uplink
Launch of interoperability testing with multiple leading infrastructure providers
Ten major device manufacturers now designing products based on QUALCOMM’s HSUPA chipset solution
QUALCOMM will be demonstrating 2.0 Mbps uplink video streaming and file transfers at EXPO COMM Japan 2006, July 19-21 in Booth #C-285.
For WCDMA (UMTS) networks, HSUPA technology, together with HSDPA technology, delivers data speeds surpassing those of many home broadband connections. QUALCOMM’s Mobile Station Modem (MSM) MSM7200 chipset, the industry’s first HSUPA solution, was used for the test calls and interoperability testing. Ten leading device manufacturers are already designing handsets based on the chipset, which offers industry-leading levels of integration to deliver significant bill-of-materials savings and to enable slim, sleek devices with support for advanced multimedia and data capabilities. [July 19, 2006]
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